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Flip Chip Bonding at CMTI

Department of Defence Research and Development

ID 2026_DRDO_778689_1 Services Sspl, Delhi Defence e-Procurement
16days to bid
Tender value
EMD deposit
₹103,500
Tender fee
Bid closes
10 Aug 2026, 02:00 PM
50
Tender Score
Our read on this opportunity
Maybe

Reasonable fit — review eligibility and effort before committing.

Success probabilityMedium
Profit opportunityMedium
CompetitionMedium
DifficultyMedium
DocumentationMedium
Est. prep time: ~7 days 16 days to bid Add your company profile for a personalised score →

Tender timeline

Published24 Jul 2026, 05:30 PM
Bid closing10 Aug 2026, 02:00 PM
Opening11 Aug 2026, 02:30 PM

Work description

Flip Chip Bonding at CMTI

Financial summary

EMD
₹103,500

EMD is a refundable deposit; tender fee is non-refundable. Compare against the estimated tender value to plan your bid.

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Tender documents

DocumentTypeDescriptionSize
Tendernotice_1.pdf PDF Attached 2185 KB PDF
BOQ.xls BOQ (Excel) BOQ_872258.xls BOQ
Tender Documents.pdf PDF RFP2627006.pdf PDF