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Processing of Epi-Wafer and Fabrication of 976nm Laser Chips and Packaging

Department of Defence Research and Development

ID 2026_DRDO_792120_1 Services Sspl, Delhi Defence e-Procurement
14days to bid
Tender value
—
EMD deposit
₹297,175
Tender fee
—
Bid closes
15 Oct 2026, 02:00 PM
50
Tender Score
Our read on this opportunity
Maybe

Reasonable fit — review eligibility and effort before committing.

Success probabilityMedium
Profit opportunityMedium
CompetitionMedium
DifficultyMedium
DocumentationMedium
Est. prep time: ~7 days 14 days to bid Add your company profile for a personalised score →

Tender timeline

Published01 Oct 2026, 05:10 PM
Bid closing15 Oct 2026, 02:00 PM
Opening16 Oct 2026, 02:30 PM

Work description

Processing of Epi-Wafer and Fabrication of 976nm Laser Chips and Packaging

Financial summary

EMD
₹297,175

EMD is a refundable deposit; tender fee is non-refundable. Compare against the estimated tender value to plan your bid.

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Tender documents

DocumentTypeDescriptionSize
Tendernotice_1.pdf PDF Attached 2452 KB PDF
Tender Documents.pdf PDF RFP2627094.pdf — PDF
BOQ.xls BOQ (Excel) BOQ_888144.xls — BOQ